Scholarship Application Site Terms of Use

This User Agreement ("Agreement") is between you and The Lacek Group LLC, with a principal place of business at 900 2nd Avenue South, Suite 1800, Minneapolis, MN 55402. Your rights and obligations under this Agreement and in using this Site are not assignable. Your use and access of the Web site constitutes your acceptance, without modification, of the terms, conditions and notices contained herein.

By using the Web site, YOU ACKNOWLEDGE THAT YOU HAVE READ THIS AGREEMENT AND THAT YOU ACCEPT THE TERMS THEREOF. Please read the following terms carefully. If you do not agree to the terms and conditions of this Agreement, you should not access, view, or otherwise use the Web site.

You agree to the terms and conditions of the Lacek Privacy Policy, which details the ways in which we and other parties might use personal information that belongs to you. In accordance with this Policy, we may use information and materials received from you or collected through your use of our Site, and may disclose such information to third parties.

You acknowledge that you own or otherwise control all of the rights to the content that you post; that the content is accurate; that use of the content you supply does not violate this Agreement and will not cause injury to any person or entity; and that you will indemnify Lacek or its affiliates for all claims resulting from content you supply.

You shall not upload, email, post or transmit to, or distribute or otherwise publish through the Web site any material which: (i) disrupts the normal flow of dialogue and/or exchange on the Site, including posting or otherwise transmitting material that is not related to the subject at issue or otherwise restricts or inhibits any other user from using the Web site; (ii) is unlawful, threatening, abusive, libelous, defamatory, obscene, vulgar, offensive, harassing, hateful, embarrassing, pornographic, profane, sexually explicit, or indecent; (iii) constitutes or encourages conduct that would constitute a criminal offense, potentially give rise to civil liability (including claims of defamation and/or libel), or otherwise violate the local, state, or national laws of any country; (iv) violates, plagiarizes, or infringes the rights of third parties including, without limitation, copyright, trademark, patent, rights of privacy or publicity, trade secrets, or any other proprietary right; (v) contains a virus, worm, Trojan horse, or other harmful component; (vi) contains any information, software, or other material of a commercial nature; (vii) contains solicitations or advertisements of any kind; (viii) constitutes or contains false or misleading indication of origin or statement of fact.

We reserve the right to release information to the proper authorities, as a result of a violation of our standards or unlawful acts, if the information is subpoenaed and/or if we deem it necessary and/or appropriate. Lacek has the right, but not the obligation, to remove content, in its sole discretion.

Lacek Sponsored Scholarships

In addition to the personal and non-personal data outlined in the Privacy Policy, additional personal information may be required if you are interacting with the Site for the purpose of applying for a Lacek sponsored scholarship. We may ask for a variety of personal details to populate your scholarship application, such as your phone number, parent contact details, high school, academic history, transcripts, student record information obtained from your high school or other educational institution, verification of enrollment, Grade Point Average (GPA), work history, letters of recommendation, affiliations and other pertinent information. We may collect information when you communicate with us and may collect content you post to the site. We may also request and collect information about you from third parties such as teachers, schools, other referral sources, and other third parties.

If you have applied for a Lacek sponsored scholarship, we use the information we collect so that we may review and consider your application order to select award recipients, or to send you information about your scholarship application. By submitting an application, you consent to the processing of your personal information by Lacek for the purpose of reviewing and considering applications and selecting award recipients.

Applicant data will only be stored as long as needed to fulfill the terms of the scholarship or for a period of time specifically required or allowed by applicable regulations or laws. Scoring sheets used in the selection process will be retained.

Protection for Children

This Site is not intended for users under the age of 13, and we have no intention of collecting personally identifiable information from children (i.e., individuals under the age of 13). If a parent or guardian learns that a child has provided us with personally identifiable information, that child’s parent or guardian should contact us and send a request marked “Privacy – Urgent” if they would like the information submitted by the child deleted from our database. We will use all reasonable efforts to delete such information from our database.

For more information on online privacy protection for children under 13, please see the Children’s Online Privacy Protection Act (COPPA).

You agree that your use of the web site is at your own risk.

This Agreement and our Privacy Policy contain the entire agreement between you and Lacek with respect to this your interaction with the site.